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编带型式陶瓷电容器
CLASS1，2，3/TAPING SPECIFICATION
Taping(Radial)
|
ltem |
Code |
Dimensions(mm) |
ltem |
Code |
Dimensions(mm) |
|
Taping Pitch |
P |
12.7+1.0 |
Laead Protrusion |
I |
+0.5—1.0 |
|
Guide Pitch |
P0 |
12.7+1.0 |
Diameter of Feed Hole |
D0 |
4.0+0.3 |
|
Lead Spacing |
F |
5.0+0.8 |
Diameter.of Leed |
d |
0.6+0.06-0.05 |
|
Feed Hold Position
Capacitor Body |
P2 |
6.35+1.3 |
Total Thickness
of Tape |
t |
0.7+0.2 |
|
Feed Hold Position
Capacitor Lead |
P1 |
3.85+0.7 |
Thickness of Capacitor.Body |
T |
3.5 |
|
Diameter of DISC |
D |
See table of
Each series |
Alignment to F.R Direction |
h |
0+2.0 |
|
Length of Snipped Leed |
L |
11.0 +0-0.1 |
|
Width of Base Tape |
W |
18.0+0.5 |
Width of Hold-down Tape |
W0 |
12.5 |
|
Feed Hole
Vertical Position |
W1 |
9.0+0.75-0.05 |
Hold-down Tape,Position |
W2 |
1.5+1.5 |
|
Taping
Height |
For Straight |
H0 |
16.0+0.5 |
Coating Extetion |
e |
1.5 |
|
For Crimp |
H |
20+1.5-1.5 |
Coating Extetion |
E1 |
up to center of crimp |
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